Liquid metal alloy base, proprietary modification process. Easy application, compression-resistant, no leakage below 400°C — working silently at the interface where thermal paste falls short.
Core principle
Liquid metal fills microscopic interface voids, conducting heat directly rather than diffusing it.
Ull-1 is made from liquid metal alloy, prepared with our proprietary modification process. While conventional thermal paste achieves 3–15 W/(m·K), Ull-1 reaches 30–40 W/(m·K) — two to three times higher than the best silicone-based compounds.
Traditional liquid metal offers higher conductivity (60+ W/(m·K)) but requires difficult application, leaks at high temperatures, and attacks aluminum substrates. Ull-1's proprietary modification process addresses all of this: easy application, compression-resistant, no settling, fully stable below 400°C.
Thermal conductivity of 30–40 W/(m·K), interface resistance of just 0.008 K·cm²/W (measured at 0.1mm, 100 psi). Two to three times higher than thermal paste, dramatically reducing the temperature delta between component and heatsink.
Traditional liquid metal overflows under pressure or high temperature, attacking nearby components. Ull-1's modification process gives it strong compression resistance — no overflow, no spreading below 400°C, keeping the thermal interface stable long-term.
Density differences in liquid metal alloy can cause sedimentation, degrading thermal performance. Ull-1's modification eliminates settling — a homogeneous, stable compound that maintains performance after 24 months of shelf storage.
Meets EU RoHS directive for restricted hazardous substances — no lead, mercury, or cadmium. Safe for consumer, industrial, and data-center deployment, meeting environmental compliance requirements across major global markets.
Ull-1 finds the optimal balance between applicability and conductivity
Lower is better. 0.008 K·cm²/W is among the lowest in class.
The defining weakness of liquid metal, resolved by proprietary modification.
Easy application is one of Ull-1's key advantages over conventional liquid metal.
No settling, no leakage means Ull-1 never needs to be replaced.
For high-power components like server CPUs and GPUs. In high-density inference and training clusters, thermal interface performance directly determines long-term stability and power efficiency.
As power module density increases, thermal interface materials must handle higher conductivity requirements and stronger compression. Ull-1 remains stable under high-pressure encapsulation.
Smartphones and tablets require optimal thermal performance in an extremely thin layer. Ull-1's easy application makes it suitable for precision assembly processes in consumer electronics manufacturing.
Network switches and routers require 24/7 continuous operation. Ull-1's no-settling, long-life properties ensure these reliability-critical deployments need no periodic re-application.
Ull-1 ships in 20 g, 50 g, and 100 g configurations, matching sample evaluation, lab development, and production stages. Custom bulk packaging is available — contact the sales team for pricing.
Custom bulk quantities available
Ideal for first evaluation and small-scale testing
For lab R&D and mid-scale deployment
For production line use at volume
Liquid metal thermal paste is available in custom packaging. Fill out the form and we'll respond within 24 hours.
Helpful details
Ull-1 is available for custom packaging and bulk orders. Contact us to request a sample or get full specifications and pricing.